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| Categories | Liquid Cooling Plate |
|---|---|
| Certification: | UL.VDE,SGS,REACH,CQC,CSA.ISO.ROHS,CUL |
| Altitude: | ≤2000m |
| Delivery Time: | 5-7 days |
| Flowrate: | Up to 10 L/min |
| Base Material: | aluminum or copper |
| Supply Ability: | 5000,000,000PCS Per Month |
| Product Technology: | CNC machine + surface finish |
| Coolant Type: | Ethylene glycol solution or silicone oil |
| Price: | Negotiable |
| Packaging Details: | Bulk |
| Thermal Dissipation Power: | 2000W |
| Payment Terms: | T/T,Paypal,Western Union,Money gram |
| Grade: | copper |
| Body Material: | Aluminum |
| Conducting Power: | 500 W |
| Ambient Temperature: | -25°C to 65°C |
| Place of Origin: | Dongguan,Guangdong,China |
| MOQ: | 1000PCS |
| Operatingtemperaturerange: | -40°C to 120°C |
| Brand Name: | UCHI |
| Process: | Epoxy Bonding |
| Mountingoptions: | Screw holes or adhesive pads |
| Company Info. |
| Guangdong Uchi Electronics Co.,Ltd |
| Verified Supplier |
| View Contact Details |
| Product List |
Full Assembly Process of Temperature Control Host for Liquid-Cooled
Mattress (All Components Corresponding to the Three Diagrams)
I. Complete Bill of Materials (Components Matched with the Three
Diagrams)
Refrigeration Core Module (Diagram 1): Dual-circuit aluminum water
cooling plates, 8 heat-conducting heat pipes, multiple TEC
thermoelectric cooling chips, red and black power supply wires for
TEC chips
Heat Dissipation Assembly (Diagram 3): Nylon insulated air duct
bracket, high-density aluminum fin radiator, copper heat equalizing
pipes, black heat-conducting base for TEC chips
Main Housing, Water Circuit and Electronic Control Components
(Disassembled Main Unit Diagram 2): Plastic main unit shell, water
storage tank, silent circulating water pump, main control PCB
circuit board, shock-absorbing sponge, wire harness clips, DC
cooling fan, water level sensor, temperature probe, external
operation panel
II. Step 1: Laminated Assembly of Refrigeration Core and Heat
Dissipation Assembly (Hot End Assembly of Core Components)
Clean the hot end surfaces of TEC cooling chips and the flat
surface of the black copper base, then evenly apply a thin layer of
thermal grease to fill gaps and reduce thermal resistance.
Press the hot ends of multiple TEC cooling chips tightly against
the black base and temporarily secure them with cable ties; arrange
the cold ends of TEC chips upward to align with the dual-circuit
aluminum water cooling plates above.
Insert one end of each copper heat pipe into the pre-reserved pipe
grooves of the black base, and feed the other end through the upper
high-density aluminum fin radiator. Ensure each heat pipe forms a
tight interference fit with the fins without loose gaps.
Fit the beige nylon insulated air duct bracket, align the mounting
holes on both sides of the radiator and fasten them with screws to
form a closed vertical air duct, ensuring all airflow from the fan
passes through the aluminum fins.
Connect the red and black power supply wires of TEC chips, route
the wire harness through the pre-set wire grooves of the bracket
and fix with clips to prevent short circuits caused by contact with
the metal radiator.
III. Step 2: Assembly of Cold-End Water Circuit Water Cooling
Plates
Apply another thin layer of thermal grease on the cold end surfaces
of TEC chips, align the dual-circuit FA/EB aluminum water cooling
plates shown in Diagram 1, and vertically press them to closely fit
all cold ends of TEC chips.
Tighten the fixing screws on both sides of the water cooling plates
with uniform force to avoid cracking TEC chips under stress; check
that the three quick-connect water ports are unobstructed and
reserve space for external mattress pipelines.
Install thermal gaskets at contact points between the upper ends of
the 8 heat-conducting heat pipes and the back of the water cooling
plates to help balance cold-end temperature and eliminate local
temperature differences.
IV. Step 3: Pre-Assembly of Water Circuit System (Water Tank +
Water Pump)
Take out the plastic main unit shell, install the yellow water
storage tank into the right cabin and fasten the limit clips to
prevent shaking and water leakage.
Connect the bottom of the water storage tank to the silent DC
circulating water pump, and compress the sealing ring to stop water
seepage; connect the water inlet and outlet of the pump to the FA
and EB circulating ports of the water cooling plates via silicone
hoses.
Connect a water flow sensor and water temperature probe in series
to the water circuit, arrange all pipelines into the side wire
grooves and reserve a water replenishing overflow port; fasten all
joints with hose clamps to prevent water seepage during
circulation.
Paste white shock-absorbing sponge at the bottom of the water pump
and radiator to isolate vibration and reduce operating noise of the
whole unit at night.
V. Step 4: Wiring and Installation of Electronic Control System
Install the main control PCB circuit board into the top cabin of
the main unit and fix insulating support posts to avoid contact
between the circuit board and the metal radiator.
Connect wire harnesses by category:
Power wires: Connect TEC red and black power wires, water pump
power cords and cooling fan power cords to the power output
terminals of the main board.
Sensor signal wires: Connect water temperature probes, mattress
zoning temperature sensors and low-water-level sensors to the
signal acquisition terminals of the main board.
Panel communication wires: Plug the flat cable of the external
operation panel into the communication interface of the main board.
Fix all wire harnesses in layers in the left wire groove with brown
plastic clips and arrange neatly to prevent pipelines and fans from
scraping wires; coil and fix redundant wires to eliminate resonance
noise.
VI. Step 5: Main Unit Casing Closing and Air Duct Assembly
Push the fully assembled refrigeration and heat dissipation module
into the middle cabin of the main unit as a whole, and fasten it to
the base with screws.
Mount the DC cooling fan at the air duct position on the front of
the radiator, with the fan blowing air toward aluminum fins to form
forced convection heat dissipation.
Align the clips on the upper and lower plastic shells of the main
unit, fasten the whole unit and lock the shell with screws; reserve
outlets for external water pipes of the water cooling plates and
power cords.
Inspect all movable parts: the fan rotates without friction, the
water pump runs smoothly without jamming, the water tank can be
pulled out normally for water replenishment, and water circuit
joints are free of extrusion and bending.
VII. Step 6: Water and Power Test of Complete Unit (Mandatory
Factory Inspection)
Water Circuit Test
Fill the water tank with distilled water, start the water pump for
10-minute circulation, and check all joints and water cooling
plates for seepage or dripping water.
Verify the water flow sensor can detect water flow normally; the
main board shall trigger low-water protection to shut down the unit
when there is no water.
Temperature Control Performance Test
Power on the operation panel, set cooling mode at 18°C and heating
mode at 45°C respectively to test independent temperature control
of the dual-circuit water channels.
Run continuously for 2 hours, check that the radiator has no
overheating, the fan speed remains stable, and TEC chips have no
high-temperature frequency reduction.
The measured night noise shall not exceed 35dB, with no obvious
vibration from water flow or abnormal fan noise.
Protection Function Test
Manually block the air duct of the radiator; the main board shall
automatically cut off power supply to TEC chips via
over-temperature protection.
Drain all water from the water tank; low-water protection will shut
down the whole unit and trigger a low-water alarm prompt on the
panel.
VIII. Key Assembly Pitfall Avoidance Tips
⚠️ Do not apply an overly thick layer of thermal grease; only a
thin coating is needed. Excessively thick grease will greatly
increase thermal resistance and reduce refrigeration efficiency.
Never bend or flatten copper heat pipes; blocked internal working
medium backflow will directly disable heat dissipation.
The nylon insulated bracket must not be omitted or removed,
otherwise contact between the metal radiator and power supply lines
will cause short circuits and burn out the circuit board.
Only distilled water is applicable to the water circuit; tap water
is prohibited during assembly and testing to prevent premature
pipeline scaling and blockage.
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