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| Categories | Dowsil Adhesive |
|---|---|
| Place of Origin: | Guangdong, China |
| Brand Name: | DowCorning |
| Model Number: | SE4450 |
| Price: | CN¥753.69/pieces 1-49 pieces |
| CAS No.: | DowCorning |
| Other Names: | DowCorning SE4450 |
| Main Raw Material: | Silicone |
| Usage: | Construction, Fiber & Garment, Footwear & Leather, Packing, Transportation, Woodworking |
| product name: | DowCorning SE4450 |
| Type: | Thermal conductive glue |
| Package: | 2kg/Piece |
| Heat Cure Time @ 150°C: | 30 minutes |
| Dielectric Strength: | 575 V/mil / 22 kV/mm |
| Thermal Conductivity: | 1.92 W/m·K |
| Volume Resistivity: | 3.3E15 Ω·cm |
| Specific Gravity (Cured): | 2.73 g/cm³ |
| MOQ: | 1 |
| Packaging Details: | 1 piece |
| Delivery Time: | 5-8days |
| Payment Terms: | T/T,L/C,D/A,D/P,Western Union,MoneyGram |
| Supply Ability: | 1000Piece |
| Certification: | TDS,SDS,Rohs |
| Company Info. |
| Shenzhen Huazhisheng New Material Technology Co., Ltd. |
| Verified Supplier |
| View Contact Details |
| Product List |
Dowsil SE 4450 is a 1-part, gray, flowable thermally conductive adhesive designed for high-reliability bonding in electronics. Key attributes include:
Type: Heat-cure silicone elastomer
Form: Non-slumping liquid with controlled flow
Color: Gray
Thermal Conductivity: 1.92 W/m·K (3.322 BTU/hr·ft·°F)
Cure Time: 30 minutes at 150°C (302°F)
Shelf Life: 6 months (stored below 4°C)
SE 4450 is engineered to address thermal management challenges in compact, high-power electronic systems. As a solvent-free, addition-cure adhesive, it eliminates voids and ensures rapid, uniform heat transfer from components like power supplies, inkjet printheads, and ICs to heat sinks. Its high tensile strength (1060 psi / 7.3 MPa) and elongation (45%) balance structural integrity with flexibility, accommodating thermal cycling and mechanical stress. The one-component formula simplifies processing, while its no-mix application reduces errors in high-volume manufacturing.
Enhanced Properties
Accelerated Curing: Achieves full adhesion in 30 minutes at 150°C, enabling faster production cycles.
Low Outgassing: Free of solvents and volatile organic compounds (VOCs), ensuring cleanliness in sealed environments.
Broad Substrate Compatibility: Bonds metals, ceramics, and filled plastics without primers (though surface preparation is recommended).
Electrical Insulation: UL 94 V-0 rated for flame retardancy, with a dielectric strength of 575 V/mil (22 kV/mm).
Thermal Stability: Maintains performance from -45°C to 200°C (-49°F to 392°F), withstanding harsh operating conditions.
While specific case studies for SE 4450 are proprietary, its attributes align with common industrial uses:
Power Electronics: Bonding IGBT modules, DC-DC converters, and power transistors in servers and renewable energy systems.
Automotive: Securing components in EV battery modules and infotainment systems exposed to vibration and temperature extremes.
LED Lighting: Thermal coupling of LED chips to substrates to prevent overheating and extend lifespan.
Consumer Electronics: Repairing or retrofitting heat sinks in laptops, gaming consoles, and wearables.

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