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For JST ZH Connector Alternatives 1.50mm Pitch Wire To Board Connectors PCB Connector

Categories Wire to Board Connectors
Brand Name: HRT
Model Number: A1500H-NP-HRT
Certification: ISO9001/ ISO14001/UL/RoHS/REACH
Place of Origin: Dongguan, China(mainland)
MOQ: 5000 pcs
Price: Negotiated
Payment Terms: TT, Western Union, PayPal, L/C
Supply Ability: 28 million pcs per month
Delivery Time: 5 to 8 working days after payment checked
Packaging Details: Bag with outside carton
Category: Crimp Housings
Application: Signal, Wire-to-Board
Material: PA66
Flammability: UL94V-0
Wire range: AWG26# to 32#
Gender: female
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    For JST ZH Connector Alternatives 1.50mm Pitch Wire To Board Connectors PCB Connector

    1.25mm Pitch Circuit Board Wire Connectors With Lock Structure PA66 / LCP Material

    1, The specification of the product including basic size information, electrical and mechanical properties.

    Basic size information
    Suitable terminalsA1500T series
    Suitable waferA1500WR/WV series
    Lock to mating partwithout
    Circuits2 to 14
    Wire insulation diameter1.15mm Max.
    Terminal materialsphosphor bronze, tin-plated
    Electrical properties
    Current Rating1A AC, DC
    Voltage Rating125V AC, DC
    Contact Resistance20mΩ Max
    Insulation Resistance100mΩ min
    Withstanding Voltage500V AC/minute
    Mechanical properties
    Temperature range-25℃ to 85 ℃
    Other information please kindly check the following picture.

    2, Related drawing and report

    Folllowing pictures are out testing report and exact engineering drawing for your information, please kindly check it, wish it can help you to get what you really need.

    Revision Control

    Rev.ECN NumberOriginatorCheckedApprovalIssue Date
    B/0New ReleaseMarike DengKevin ChenJacky Qi06/20/2010

    Product Summary Test Report Origination

    Originator by DateChecked by DateApproved by Date
    Marike Deng 06/20/10’Kevin Chen 06/20/10’Jacky Qi 06/25/10’

    This document is the property of Xin Pei Enterprise and delivered on the express condition that it is not be disclosed, reproduced or used, in whole or in part, for manufacture or sale by anyone other than Xin Pei Enterprise.

    Without its prior consent, and that no right is granted to disclose or to use any information in this document.

    1. Scope

    This specification covers the requirements for product performance of 1.50mm pitch wire to board

    connectors series.

    2. Construction,Dimensions,Material & Plating

    See the attached drawings

    3. Ratings & Applicable Wires

    Rated Voltage (Max.)100V AC/DCInsulation O.D. 1.10mm (Max.)
    Rated Current (Max.) And Applicable WiresAWG#261A AC/DC
    AWG#281A AC/DC
    AWG#301A AC/DC
    AWG#320.8A AC/DC
    Ambient Temperature Range-25℃ ~ +85℃*

    *: Including terminal temperature rise

    4. Electrical Performance

    Test DescriptionProcedureRequirement

    Contact Resistance

    Mate connectors, measure by dry circuit, 20mV max., 10mA.(Based upon JIS C5402 5.4)20mΩ (Max.)
    4-2Insulation ResistanceMate connectors, apply 500V DC between adjacent terminal or ground. (Based upon JIS C5402 5.2/MIL-STD-202 Method 302 Cond. B)500MΩ (Min.)
    4-3Dielectric Withstanding VoltageMate connectors, apply 500V AC (rms) for 1 minute between adjacent terminal or ground. (Based upon JIS C5402 5.1/MIL-STD-202 Method 301)No Breakdown.
    4-4Contact Resistance on Crimped PortionCrimp the applicable wire on to the terminal, measure by dry circuit, 20mV (Max.)., 10mA.5mΩ (Max.)

    5. Mechanical Performance

    Test DescriptionProcedureRequirement
    5-1Actuator Insertion & Withdrawal ForceInsert and withdraw connectors at the speed rate of 25±3mm / minute.Refer to paragraph 7
    5-2Crimping Pull Out ForceFix the crimped terminal, apply axial pull out force on the wire at the speed rat of 25±3mm / minute.(Based upon JIS C5402 6.8)AWG#262.0kgf (Min)
    AWG#281.0kgf (Min)
    AWG#300.8kgf (Min)
    AWG#320.5kgf (Min)
    5-3Terminal Insertion Force.Insert the crimped terminal into the housing.1.00kgf (Max.)
    5-4Terminal/Housing Retention Force.Apply axial pull out force at the speed rate of 25±3mm / minute on the terminal assembled in the housing.1.00kgf (Min.)
    5-5Pin Retention ForceApply axial push force at the speed rate of 25±3mm / minute0.70kgf (Min.)
    5-6DurabilityWhen mated up to 50 cycles repeatedly by the rate of 10 cycle per minute.Contact Resistance 40mΩ (Max.)

    Amplitude: 1.5mm P-P

    Sweep time: 10-55-10 Hz in 1 minute Duration: 2 hours in each X.Y.Z. axes.

    (Based upon MIL-STD-202 Method 201A)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    Discontinuity 1 μsec.(Max.)

    5-8Physical Shock490m/s²{50G},3 strokes in each X.Y.Z. axes. (Based upon JIS C0041/MIL-STD-202 Method 213B Cond. A)

    6. Environmental Performance And Others

    Test DescriptionProcedureRequirement
    6-1Temperature RiseCarrying rated current load.(Based upon UL 498)30℃(Max.)
    6-2Heat Resistance85±2℃,96 hours (Based upon JIS C0021/MIL-STD-202 Method 108A Cond. A)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-3Cold Resistance-25±3℃,96 hours (Based upon JIS C0020)

    Temperature: 40±2℃

    Relative Humidity : 90~95%

    Duration: 96 hours

    (Based upon JIS C0022/MIL-STD-202 Method 103B Cond. B)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    Insulation Resistance 50MΩ (Min.)

    Dielectric Withstanding Voltage Must meet 4-3

    6-5Temperature Cycling

    5 cycles of:

    a) -55℃ 30 minutes

    b) +85℃ 30 minutes

    (Based upon JIS C0025)

    Appearance No Damage.

    Contact Resistance 40mΩ (Max.)

    6-6Salt SprayTin-plated 12 hours / Gold- plated 24 hours exposure to a salt spray from the 5±1% solution at 35±2℃. (Based upon JIS C0023/MIL-STD-202 Method 101D Cond. B)
    6-7SO2 Gas

    24 hours exposure to 50±5ppm.

    SO2 gas at 40±2℃.

    6-8NH3 Gas40 minutes exposure to NH3 gas evaporating from 28% Ammonia solution.


    Soldering Time: 5±0.5 sec.

    Solder Temperature: 245±5℃

    Solder Wetting 95% of immersed area must show no voids, pin holes

    Resistance to Soldering Heat


    Solder pot method

    Soldering time: 10±0.5 sec.

    Solder Temperature: 260±5℃

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.
    6-11Resistance to Soldering Heat (SMT)

    When reflowing

    Refer to paragraph 8

    Solder iron method

    Soldering Time: 5±0.5 sec.

    Solder Temperature: 370℃ ~ 400℃

    Appearance No Damage.

    7. Actuator Insertion/Withdrawal Force

    [Unit : kgf]

    CircuitsAt Initial
    Insertion (Max.)Withdrawal (Min.)

    3, HRT main product show

    You can get more series parts from the below picture, it's our main product picture from our different type.

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